The outcomes aren’t a lot enticing from a viewpoint of the etch rate enhancement compared to the effect of etching temperature and the addition of oxidizers as might be mentioned in next sections. Hsieh et al. used this course of to manufacture a biocompatible flexible IC. At first a wafer lapping machine is used to thin the Si wafer substrate, and the thickness is decreased to ∼50 μm . Following lapping, a dry XeF2 etching process with BOX as etch stop layer is carried out to take away the surface micro-crack damages that are caused by the lapping course of .
Laser fluences (or energy densities, usually given in J/cm2) outdoors an optimal vary lead to decreased materials removal effectivity...Read More