The mechanisms of CMP and XeF2 RIE are already introduced on this chapter, and in this part the comparability between CMP, XeF2 RIE, and lapping is described. Following that, the method flow is described by way of the instance by which lapping, CMP, and RIE are employed to skinny the silicon substrate. Recently, Pastewka et al. demonstrated that molecular dynamics simulations can contribute to an understanding of micro-machining processes, if the breaking and formation of chemical bonds is taken into consideration. The process studied by the authors was the polishing of diamond with diamond grains for various surface pairings.
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