In wet bulk micromachining, the etch fee is a important component that impacts the throughput. Several methods have been proposed to increase the etch price of silicon in moist anisotropic etchants both by bodily means (e.g. agitation, microwave irradiation) or chemically by incorporation of components. The ultrasonic agitation throughout etching and microwave irradiation on the etchants improve the etch rate.
To regulate the penetration of the film/slurry, the wafers either spin sooner or experience a heavier load to suit the goal specification. With a give attention to tools for machining very small workpieces and features, this month’s product highlight runs the gamut from micro drills to waterjets to dedicated micromachining centers...Read More