The exceptional function of these strategies is that little heat affected layer remains on the machined surface. This results in the potential for machining microshapes with excessive dimensional accuracy and less defects in the surface layer. The main drawbacks are low efficiency in materials removal and consequently, low machining velocity another disadvantage is the excessive value of kit because of their quick history.
Generally, polysilicon is used as one of many substrate layers while silicon dioxide is used as a sacrificial layer. The sacrificial layer is eliminated or etched out to create any essential void in the thickness course. The primary benefit of this machining process is the flexibility to construct electronic and mechanical elements on the same substrate...Read More