The schema of CMP software and course of to polish wafer are shown in Figure 5 . A wafer is firstly held by the polishing head utilizing a vacuum after which the polishing head begins to rotate, ensuing in the rotation of held wafer on the polishing pad . The slurry used within the CMP process is allotted via a slurry arm with the help of sprucing pad conditioner, and the sharpening pad surface is refreshed for each sprucing course of in order that global planarization and sharpening can be achieved . During CMP course of, the wafer is polished through abrasive and chemistry, and the complicate interaction between pad asperity, slurry, and wafer floor is described in Figure 5 in a microscale statement ...Read More
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